Are you looking quote for part LTEDM10005101-2? The Georgia Tech Applied Research-manufactured component (CAGE Code: 1FEZ4) is documented under NSN 5998-01-629-8374 as Circuit Card Assemb. For the fastest quote, please complete our RFQ form with details about LTEDM10005101-2. We guarantee a response within 15 minutes.
ASAP Components provides the verified LTEDM10005101-2, classified under INC 61638, FSG 59 Electrical and Electronic Equipment Components, FSC 5998 Electrical and Electronic Assemblies Boards Cards and Associated Hardware, NIIN 01-629-8374, and NCB 01. Submit your requirements today to receive immediate pricing and availability information.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5998-01-629-8374 Item PartTypeName: CIRCUIT CARD ASSEMBLY | 5998 | 016298374 | N | A | ||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| A | A | 0 | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| LTEDM10005101-2 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CXCY | Part Name Assigned By Controlling Agency | SPAWN CONFIGURATION GUIDE |
| AGAV | End Item Identification | ALR-56M RSM 1 |
| MRC | Decoded Requirement | Clear Text Reply |
| End Use : 21320 | Semiconductors |
|---|---|
| Schedule B : 8542900000 (NAICS 334413) | Electronic integrated circuits and microassembly parts |
| SITC : 77689 | Parts of electronic integrated circuits and microassembles |
| ADPE | Represents items with no adp components |
|---|---|
| CRITL | The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. |
| ESD | A - No known electrostatic discharge (esd) or electromagnetic interference (emi) sensitivity. |
| HMIC | N - Indicates there is no data in the hmirs and the nsn is in a fsc not generally suspected of containing hazardous materials. |
| PMIC | A - Item does not contain precious metal. |
